| ชื่อบทความ | Optimized TLP joining of SSM 6063 aluminium alloy using ZnAl27Cu₂ powder interlayers via RSMGA |
|---|---|
| ประเภทการตีพิมพ์ | วารสารวิชาการระดับนานาชาติ |
| ชื่องานประชุมวิชาการ/วารสาร | Journal of Engineering Research |
| ผู้แต่ง |
ชัยยุทธ มีงาม |
| วันที่ตีพิมพ์/นำเสนอ | 19 ก.ย. 2569 |
| ปีที่ | 2026 |
| ฉบับที่ | 14 |
| หมายเลขหน้า | 1-17 |
| ลักษณะบทความ | |
| Abstract | Reliable joining of Al-6xxx components is constrained by stable surface oxides and brittle ZnAl intermetallic compounds (IMCs). This work addresses that gap by establishing a quantitative process window for transient liquid phase (TLP) bonding of semi-solid metal 6063 (SSM 6063) aluminum alloy using ZnAl27Cu₂ powder interlayers. Cylindrical coupons were bonded under argon at 842 or 932 ◦F for 90 or 120 min with interlayer particle sizes of 100, 300, and 500 µm. Joint quality was assessed by ASTM E8 tensile tests, Vickers microhardness (HV0.1) traverses, optical microscopy (OM)/scanning electron microscopy (SEM) imaging, spot energydispersive X-ray spectroscopy (EDX), and a hybrid Response Surface MethodologyGenetic Algorithm (RSMGA) framework to map the coupled effects of bonding temperature, bonding time, and particle size. Three parallel specimens were tested per condition to ensure data reliability. The highest experimentally measured bonding strength (22.31 ± 1.4 MPa) was obtained at 842 ◦F/90 min with a 300 µm interlayer, whereas the lowest strength (10.72 ± 0.9 MPa) occurred at 932 ◦F/120 min with 500 µm powder, highlighting the detrimental effect of excessive heat input and coarse particles. Microhardness profiles showed a centerline trough as low as ~55 HV at 842 ◦F/90 min (100 µm), improving to ~8085 HV at the seam under higher heat-input conditions, while the base metal stabilized near ~120 HV. Multi-response optimization via RSMGA predicted an optimum at 236.8 µm/90 min/842 ◦F, giving a balanced response of 18.97 MPa bonding strength and 91.43 HV microhardness in close agreement with experiments. Microstructurally, sound joints exhibited thin, discontinuous η-(Zn)/ZnAl₂ seams formed via Zn-rich transient liquid formation, oxide disruption, and isothermal solidification, whereas excessive heat input coarsened IMCs and promoted micro-cracks, unbonded lines, and voids from unmelted Zn-rich islands. Overall, an intermediate powder size (~300 µm), lower bonding temperature (842 ◦F), and shorter bonding time (90 min) provide a practical process window that maximizes capillary backfilling while limiting IMC thickening, offering actionable guidance for robust, lightweight Al assemblies in transportation and structural applications. |
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